| Title | Syllabus | Reference |
|---|---|---|
| Ultra-Precision Machining | Single Point Tool Approach – Principles of single point diamond turning, Machine tool, Single and polycrystalline diamond tools; Chip formation and surface quality evaluation, Modeling of machining mechanics, Implications of size-effect and minimum depth of cut. UP machining of brittle materials: Ductile regime machining of ceramics and glasses, Cutting tool geometry and modeling of ductile-brittle transition in material removal mechanisms. Multi-point Tool Approach – Micro-cutting, Micro-drilling and micro-milling; Mechanics of machining including the effect of scale reduction, Cutting tool geometry and manufacture. Abrasive Tool Approach – Atomic cluster processing using Nano- and micro-grinding, Elastic emission machining, Form lapping and honing, In-process-electrolytic grinding, Magnetic abrasive finishing, Nanometric processing of soft and hard materials using dislocation defects. Damage-free surface machining of semiconductor wafers using chemical and mechano-chemical and polishing, Processing mechanisms. Energy Beam Approach – Focused Ion Beam (FIB) Machining for nanometric material removal, Collision mechanisms, Accuracy and surface generation; Electron Beam Machining: Mechanism of machining, Theoretical considerations, Surface generation and HAZ; Scanning Tunneling Microscope (STM) processing using electron beam for fabrication of nano-structures, Chemical and thermal effects. | J. McGeough, Micromachining of Engineering Materials, Marcel Dekker, Inc.,
NY, 2002. V. K. Jain, Advanced Machining Processes, Allied Publishers, New Delhi, 2002. N. Taniguchi, Nanotechnology: Integrated Processing Systems for Ultra-precision and Ultra-fine Products, Oxford University Press Inc., NY, 1996. M. C. Shaw, Principles of Abrasive Processing, Oxford: Clarendon Press, 1996. |