Tarlochan Singh, Akshay Dvivedi, Anurag Shanu, Pradeep Dixit, Experimental Investigations of Energy Channelization Behavior in Ultrasonic Assisted Electrochemical Discharge Machining, Journal of Materials Processing Technology, 293, , 2021, , 117083

Harindra Kumar Kannojia, and Pradeep Dixit, A comprehensive review of intermetallic compound growth and void formation in electrodeposited Cu-Sn Layers for microsystems packaging, Journal of Materials Science: Materials in Electronics, 32, , 2021, ,

Julfekar Arab, Karan Pawar, Pradeep Dixit, Effect of tool-electrode material in through-hole formation using ECDM process, Materials and Manufacturing Processes, 39, , 2021, https://doi.org/10.1080/10426914.2021, 1-9

Julfekar Arab, Dileep Kumar Mishra, Pradeep Dixit, Measurement and analysis of the geometric characteristics of microholes and tool wear for varying tool-workpiece gaps in electrochemical discharge drilling, Measurement, 168, , 2021, , 108463

Priyaranjan Sharma, Julfekar Arab, Pradeep Dixit, Through-holes micromachining of alumina using a combined pulse-feed approach in ECDM, Materials and Manufacturing Processes, 36, , 2021, ,

Dileep Kumar Mishra, Pradeep Dixit, Experimental investigation into tool wear behaviour of line-array tool electrode during the electrochemical discharge micromilling process, Journal of Manufacturing Processes, 72, 12, 2021, , 93-104

Julfekar Arab, Pradeep Dixit, Influence of tool electrode feed rate in the electrochemical discharge drilling of a glass substrate, Materials and Manufacturing Processes, 35, , 2020, ,

Priyaranjan Sharma, Dileep Kumar Mishra, Pradeep Dixit, Experimental investigations into alumina ceramic micromachining by electrochemical discharge machining process, Procedia Manufacturing, 48, , 2020, , 244-250

Awatef Khlifi, Aftab Ahmed, Shardul Pandit, Brahim Mezghani, Rajul Patkar, Pradeep Dixit, Maryam Shojaei Baghini, Experimental and Theoretical Dynamic Investigation of MEMS Polymer Mass-Spring Systems, IEEE Sensors, 20, 14, 2020, ,

Aftab Ahmed, Awatef Khlifi, Shardul Pandit, Rajul Patkar, Anjali Joshi, Pradeep Dixit, Brahim Mezghani, Maryam Shojaei Baghini, Design, fabrication, and characterization of SU-8/carbon black nanocomposite based polymer MEMS acceleration sensor, Microsystem Technologies, , , 2020, https://doi.org/10.1007/s00542-020-04824-7,

Dileep Kumar Mishra, Karan Pawar, Pradeep Dixit, Effect of tool electrode-workpiece gap in the microchannel formation by electrochemical discharge machining, ECS Journal of Solid State Science and Technology, 9, 3, 2020, , 034011

Aman Kumar Verma, Dileep Kumar Mishra, Karan Pawar, Pradeep Dixit, Investigations into Surface topography of glass microfeatures formed by pulsed Electrochemical discharge milling for microsystem applications, Microsystems Technology, , , 2020, ,

Subrat Patro, Dileep Kumar Mishra, Julfekar Arab, Pradeep Dixit, Numerical and experimental analysis of high aspect ratio micro-tool electrodes fabrication using controlled electrochemical machining, Journal of Applied Electrochemistry, 50, , 2020, https://doi.org/10.1007/s10800-019-01380-5, 169-184

Pradeep Dixit, Harindra Kumar Kannojia, Kimmo Hentinen, Through-substrate vias based three-dimensional interconnection technology, Handbook of Silicon Based MEMS Materials and Technologies, , , 2020, ,

Julfekar Arab, Dileep Kumar Mishra. Harindra Kumar Kannojia, Pratik Adhale, and Pradeep Dixit, Fabrication of multiple through-hole array in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging, Journal of Materials Processing Technology, 271, , 2019, , 542

Harindra Kumar Kannojia, Julfekar Arab, Bhaskar Jyoti Pegu, and Pradeep Dixit, Fabrication and Characterization of Through-Glass Vias by the ECDM Process, Journal of Electrochemical Society, 166, , 2019, , D531

Julfekar Arab, Harindra Kumar kannojia, and Pradeep Dixit, Effect of tool electrode roughness on the geometric characteristics of through-holes formed by ECDM, Precision Engineering, 60, , 2019, , 437

Julfekar Arab, Dileep Kumar Mishra, Pratik Adhale, Pradeep Dixit, Micro array hole formation in glass using electro-chemical discharge machining, Procedia Manufacturing, 34, , 2019, , 349

Julfekar Arab, Harshit singh Chauhan, Chetan Agrawal, Pradeep Dixit, Electrochemical discharge machining of soda lime glass for MEMS application, International Journal of Precision Technology, 8, , 2019, , 220

Dileep Mishra, Aman Kumar Verma, Julfekar Arab, Deepak Marla, and Pradeep Dixit, Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining, Journal of Micromechanics and Microengineering, 29, 7, 2019, , 075004

Dileep Mishra, Julfekar Arab, Yashwant Magar, and Pradeep Dixit, High Aspect Ratio Glass Micromachining by Multi-Pass Electrochemical Discharge Based Micromilling Technique, ECS Journal of Solid State Science and Technology , 8, 6, 2019, , P322-P331

Harindra Kumar Kannojia, and Pradeep Dixit, Experimental investigations in the intermetallic and microvoid formation in sub‑200 °C Cu–Sn bonding, Journal of Materials Science: Materials in Electronics, 30, , 2019, https://doi.org/10.1007/s10854-019-02017-1, 19

Harindra Kumar Kannojia, and Pradeep Dixit, Effect of surface roughness on void formation and intermetallic growth in electodeposited Cu-Sn stacks, Materials letters, 257, , 2019, https://doi.org/10.1016/j.matlet.2019.126710,

Khan, Kamran, Alwin Varghese, Pradeep Dixit, and Suhas S. Joshi, Effect of Tool Path Complexity on Top Burrs in Micromilling, Procedia Manufacturing, 34, , 2019, , 432-439

Kannojia H.K., Sharma S.K., Dixit P.,Void Formation and Intermetallic Growth in Pulse Electrodeposited Cu-Sn Layers for MEMS Packaging,Journal of Electronic Materials,,,2018,.

Dixit P., Henttinen K.,Via Technologies for MEMS,Handbook of Silicon Based MEMS Materials and Technologies: Second Edition,1,1,2015,694.

Arora S., Lim C.S., Foo J.Y., Sakharkar M.K., Dixit P., Liu A.Q., Miao J.-M.,Microchip system for monitoring microbial physiological behaviour under drug influences,Proceedings of the Institution of Mechanical Engineers, Part H: Journal of Engineering in Medicine,223,6,2015,777.

Lin N., Miao J., Dixit P.,Void formation over limiting current density and impurity analysis of TSV fabricated by constant-current pulse-reverse modulation,Microelectronics Reliability,53,12,2013,1943.

Dixit P., Vähänen S., Salonen J., Monnoyer P.,Effect of process gases on fabricating tapered through-silicon vias by continuous SF6/O2/Ar plasma etching,ECS Journal of Solid State Science and Technology,1,3,2012,P107.

Dixit P., Vehmas T., Vähänen S., Monnoyer P., Henttinen K.,Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias,Journal of Micromechanics and Microengineering,22,5,2012,.

Dixit P., Salonen J., Pohjonen H., Monnoyer P.,The application of dry photoresists in fabricating cost-effective tapered through-silicon vias and redistribution lines in a single step,Journal of Micromechanics and Microengineering,21,2,2011,.

Lin N., Miao J., Dixit P.,Mechanical and microstructural characterization of through-silicon via fabricated with constant current pulse-reverse modulation,Journal of the Electrochemical Society,157,6,2010,D323.

Arora S., Lim C.S., Kakran M., Foo J.Y.A., Sakharkar M.K., Dixit P., Miao J.,Investigating Combinatorial Drug Effects on Adhesion and Suspension Cell Types Using a Microfluidic-Based Sensor System,IFMBE Proceedings,23,,2009,817.

Arora S., Lim C.S., Foo J.Y., Sakharkar M.K., Dixit P., Liu A.Q., Miao J.-M.,Microchip system for monitoring microbial physiological behaviour under drug influences,Proceedings of the Institution of Mechanical Engineers, Part H: Journal of Engineering in Medicine,223,6,2009,777.

Lin N., Wang H., Dixit P., Xu T., Zhang S., Miao J.,Investigation of carbon nanotube growth on multimetal layers for advanced interconnect applications in microelectronic devices,Journal of the Electrochemical Society,156,3,2009,K23.

Xu L., Xu D., Tu K.N., Cai Y., Wang N., Dixit P., Pang J.H.L., Miao J.,Structure and migration of (112) step on (111) twin boundaries in nanocrystalline copper,Journal of Applied Physics,104,11,2008,.

Dixit P., Yaofeng S., Miao J., Pang J.H.L., Chatterjee R., Tummala R.R.,Numerical and experimental investigation of thermomechanical deformation in high-aspect-ratio electroplated through-silicon vias,Journal of the Electrochemical Society,155,12,2008,H981.

Dixit P., Chen X., Miao J., Preisser R.,Effect of improved wettability of silicon-based materials with electrolyte for void free copper deposition in high aspect ratio through-vias,Thin Solid Films,516,16,2008,5194.

Dixit P., Lin N., Miao J., Wong W.K., Choon T.K.,Silicon nanopillars based 3D stacked microchannel heat sinks concept for enhanced heat dissipation applications in MEMS packaging,Sensors and Actuators, A: Physical,141,2,2008,685.

Dixit P., Miao J.,High aspect ratio vertical through-vias for 3D MEMS packaging applications by optimized three-step deep RIE,Journal of the Electrochemical Society,155,2,2008,H85.

Dixit P., Xu L., Miao J., Pang J.H.L., Preisser R.,Mechanical and microstructural characterization of high aspect ratio through-wafer electroplated copper interconnects,Journal of Micromechanics and Microengineering,17,9,2007,1749.

Dixit P., Chen X., Miao J., Divakaran S., Preisser R.,Study of surface treatment processes for improvement in the wettability of silicon-based materials used in high aspect ratio through-via copper electroplating,Applied Surface Science,253,21,2007,8637.

Dixit P., Tan C.W., Xu L., Lin N., Miao J., Pang J.H.L., Backus P., Preisser R.,Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating,Journal of Micromechanics and Microengineering,17,5,2007,1078.

Xu L., Dixit P., Miao J., Pang J.H.L., Zhang X., Tu K.N., Preisser R.,Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins,Applied Physics Letters,90,3,2007,.

Dixit P., Miao J., Preisser R.,Erratum: Fabrication of high-aspect-ratio 35 μm pitch through-wafer copper interconnects by electroplating for 3D wafer stacking (Electrochemical and Solid-State Letters (2006) 9 (G305)),Electrochemical and Solid-State Letters,9,12,2006,.

Dixit P., Miao J., Preisser R.,Fabrication of high aspect ratio 35 μm pitch through-wafer copper interconnects by electroplating for 3-D wafer stacking,Electrochemical and Solid-State Letters,9,10,2006,G305.

Dixit P., Miao J.,Effect of clamping ring materials and chuck temperature on the formation of silicon nanograss in deep RIE,Journal of the Electrochemical Society,153,8,2006,G771.

Dixit P., Miao J.,Aspect-ratio-dependent copper electrodeposition technique for very high aspect-ratio through-hole plating,Journal of the Electrochemical Society,153,6,2006,G552.

Dixit P., Miao J.,Effect of SF6 flow rate on the etched surface profile and bottom grass formation in deep reactive ion etching process,Journal of Physics: Conference Series,34,1,2006,577.